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公开(公告)号:US12237241B2
公开(公告)日:2025-02-25
申请号:US17718662
申请日:2022-04-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yanggyoo Jung , Seungbin Baek , Hyunjung Song , Jisun Yang
IPC: H01L23/31 , H01L21/48 , H01L21/56 , H01L23/00 , H01L23/498 , H01L25/065
Abstract: A semiconductor package includes: a package substrate; an interposer disposed on the package substrate; a first semiconductor chip mounted on the interposer; a second semiconductor chip mounted on the interposer adjacent to the first semiconductor chip, the second semiconductor chip having an overhang portion that does not overlap the interposer in a vertical direction; a first underfill disposed between the package substrate and the interposer, the first underfill having a first extension portion extending from a side surface of the interposer; a second underfill disposed between the interposer and the second semiconductor chip, the second underfill having a second extension portion extending to an upper surface of the package substrate along at least a portion of the first extension portion of the first underfill, wherein the second extension portion protrudes from the overhang portion contact the upper surface of the package substrate.
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公开(公告)号:US11158603B2
公开(公告)日:2021-10-26
申请号:US16298476
申请日:2019-03-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyoeun Kim , Ji Hwang Kim , Jisun Yang , Seunghoon Yeon , Chajea Jo , Sang-Uk Han
IPC: H01L25/065 , H01L23/00 , H01L23/538
Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.
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公开(公告)号:US12048405B2
公开(公告)日:2024-07-30
申请号:US17950743
申请日:2022-09-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Johannes Büsing , Jisun Yang
CPC classification number: A47L15/22 , A47L15/421 , A47L15/4225 , A47L15/4278
Abstract: A dishwasher includes a tub, a basket, a spray device configured to spray washing water, and a sump configured to supply the washing water to the spray device. The spray device includes a first spray rotor including a first spray arm and a shaft integrally formed with the first spray arm to guide the washing water supplied from the sump to the first spray arm, a second spray rotor rotatably coupled to the shaft and including a second spray arm configured to spray the washing water branched from the washing water guided to the first spray arm through the shaft, and a shaft hole formed in the second spray arm to allow the shaft to pass therethrough, and a communication hole formed in the shaft to allow the shaft to communicate with the second spray arm.
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公开(公告)号:US11569201B2
公开(公告)日:2023-01-31
申请号:US17509750
申请日:2021-10-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyoeun Kim , Ji Hwang Kim , Jisun Yang , Seunghoon Yeon , Chajea Jo , Sang-Uk Han
IPC: H01L25/065 , H01L23/00 , H01L23/538
Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.
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公开(公告)号:US11564553B2
公开(公告)日:2023-01-31
申请号:US17090101
申请日:2020-11-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Johannes Büsing , Jisun Yang
Abstract: Provided is a structure of a sump assembly of a dishwasher. The dishwasher includes a tub forming a washing chamber, and a sump assembly provided at a lower side of the washing chamber and configured to store washing water in the washing chamber, wherein the sump assembly includes a sump housing having a water storage chamber storing the washing water and a sidewall portion forming the water storage chamber, and a heater provided on the sidewall portion to apply heat to the washing water stored in the sump assembly. The heater includes a planar heating element, and the planar heating element provided in a cylindrical shape forms the sidewall portion.
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