公开(公告)号：US12237241B2

公开(公告)日：2025-02-25

申请号：US17718662

申请日：2022-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yanggyoo Jung ,  Seungbin Baek ,  Hyunjung Song ,  Jisun Yang

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: A semiconductor package includes: a package substrate; an interposer disposed on the package substrate; a first semiconductor chip mounted on the interposer; a second semiconductor chip mounted on the interposer adjacent to the first semiconductor chip, the second semiconductor chip having an overhang portion that does not overlap the interposer in a vertical direction; a first underfill disposed between the package substrate and the interposer, the first underfill having a first extension portion extending from a side surface of the interposer; a second underfill disposed between the interposer and the second semiconductor chip, the second underfill having a second extension portion extending to an upper surface of the package substrate along at least a portion of the first extension portion of the first underfill, wherein the second extension portion protrudes from the overhang portion contact the upper surface of the package substrate.

公开(公告)号：US11158603B2

公开(公告)日：2021-10-26

申请号：US16298476

申请日：2019-03-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyoeun Kim ,  Ji Hwang Kim ,  Jisun Yang ,  Seunghoon Yeon ,  Chajea Jo ,  Sang-Uk Han

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/538

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.

公开(公告)号：US12048405B2

公开(公告)日：2024-07-30

申请号：US17950743

申请日：2022-09-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Johannes Büsing ,  Jisun Yang

IPC: A47L15/22 ,  A47L15/42

CPC classification number: A47L15/22 ,  A47L15/421 ,  A47L15/4225 ,  A47L15/4278

Abstract: A dishwasher includes a tub, a basket, a spray device configured to spray washing water, and a sump configured to supply the washing water to the spray device. The spray device includes a first spray rotor including a first spray arm and a shaft integrally formed with the first spray arm to guide the washing water supplied from the sump to the first spray arm, a second spray rotor rotatably coupled to the shaft and including a second spray arm configured to spray the washing water branched from the washing water guided to the first spray arm through the shaft, and a shaft hole formed in the second spray arm to allow the shaft to pass therethrough, and a communication hole formed in the shaft to allow the shaft to communicate with the second spray arm.

公开(公告)号：US11569201B2

公开(公告)日：2023-01-31

申请号：US17509750

申请日：2021-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyoeun Kim ,  Ji Hwang Kim ,  Jisun Yang ,  Seunghoon Yeon ,  Chajea Jo ,  Sang-Uk Han

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/538

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.

公开(公告)号：US11564553B2

公开(公告)日：2023-01-31

申请号：US17090101

申请日：2020-11-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Johannes Büsing ,  Jisun Yang

IPC: A47L15/22 ,  A47L15/42

Abstract: Provided is a structure of a sump assembly of a dishwasher. The dishwasher includes a tub forming a washing chamber, and a sump assembly provided at a lower side of the washing chamber and configured to store washing water in the washing chamber, wherein the sump assembly includes a sump housing having a water storage chamber storing the washing water and a sidewall portion forming the water storage chamber, and a heater provided on the sidewall portion to apply heat to the washing water stored in the sump assembly. The heater includes a planar heating element, and the planar heating element provided in a cylindrical shape forms the sidewall portion.