Semiconductor package
    1.
    发明授权

    公开(公告)号:US12237241B2

    公开(公告)日:2025-02-25

    申请号:US17718662

    申请日:2022-04-12

    Abstract: A semiconductor package includes: a package substrate; an interposer disposed on the package substrate; a first semiconductor chip mounted on the interposer; a second semiconductor chip mounted on the interposer adjacent to the first semiconductor chip, the second semiconductor chip having an overhang portion that does not overlap the interposer in a vertical direction; a first underfill disposed between the package substrate and the interposer, the first underfill having a first extension portion extending from a side surface of the interposer; a second underfill disposed between the interposer and the second semiconductor chip, the second underfill having a second extension portion extending to an upper surface of the package substrate along at least a portion of the first extension portion of the first underfill, wherein the second extension portion protrudes from the overhang portion contact the upper surface of the package substrate.

    Dishwasher
    3.
    发明授权

    公开(公告)号:US12048405B2

    公开(公告)日:2024-07-30

    申请号:US17950743

    申请日:2022-09-22

    CPC classification number: A47L15/22 A47L15/421 A47L15/4225 A47L15/4278

    Abstract: A dishwasher includes a tub, a basket, a spray device configured to spray washing water, and a sump configured to supply the washing water to the spray device. The spray device includes a first spray rotor including a first spray arm and a shaft integrally formed with the first spray arm to guide the washing water supplied from the sump to the first spray arm, a second spray rotor rotatably coupled to the shaft and including a second spray arm configured to spray the washing water branched from the washing water guided to the first spray arm through the shaft, and a shaft hole formed in the second spray arm to allow the shaft to pass therethrough, and a communication hole formed in the shaft to allow the shaft to communicate with the second spray arm.

    Dish washer
    5.
    发明授权

    公开(公告)号:US11564553B2

    公开(公告)日:2023-01-31

    申请号:US17090101

    申请日:2020-11-05

    Abstract: Provided is a structure of a sump assembly of a dishwasher. The dishwasher includes a tub forming a washing chamber, and a sump assembly provided at a lower side of the washing chamber and configured to store washing water in the washing chamber, wherein the sump assembly includes a sump housing having a water storage chamber storing the washing water and a sidewall portion forming the water storage chamber, and a heater provided on the sidewall portion to apply heat to the washing water stored in the sump assembly. The heater includes a planar heating element, and the planar heating element provided in a cylindrical shape forms the sidewall portion.

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