公开(公告)号：US11805633B2

公开(公告)日：2023-10-31

申请号：US16638645

申请日：2018-07-11

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hyun-Tae Jang ,  Min Park ,  Byung Hoon Lee ,  Youngchul Lee ,  Changjoon Lee ,  Jiyoung Jang ,  Youngjun Moon ,  Minyoung Park ,  Jeonggen Yoon ,  Won Choi ,  Siho Jang

IPC分类号： H05K13/04 ,  H01L33/00 ,  H05K13/02

CPC分类号： H05K13/041 ,  H01L33/005 ,  H05K13/02 ,  H05K13/0409 ,  Y10T29/53174

摘要： According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.