公开(公告)号：US10401557B2

公开(公告)日：2019-09-03

申请号：US15078488

申请日：2016-03-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong In Kim ,  Ho Young Song ,  Yong Il Kim

IPC: H01L33/46 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  F21V8/00 ,  F21Y101/00

Abstract: A semiconductor light emitting device includes a wiring board including a mounting surface on which a first wiring electrode and a second wiring electrode are disposed; a semiconductor light emitting diode (LED) chip including a first surface on which a first electrode and a second electrode are disposed, the first surface facing the mounting surface, the semiconductor LED chip further including a second surface positioned opposite to the first surface, and side surfaces positioned between the first and second surfaces, the first and second electrodes being connected to the first and second wiring electrodes, respectively; and a reflective layer disposed on at least one of the second surface and the side surfaces of the semiconductor LED chip.