公开(公告)号：US20250073843A1

公开(公告)日：2025-03-06

申请号：US18440747

申请日：2024-02-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Imbi Yeo ,  Sukhoon Jeong ,  Jonghyeon Jeong ,  Seyun Park ,  Myeongjin Lee

IPC: B24B37/32

Abstract: An example retainer ring module includes a retainer ring and at least one slurry passage. The retainer ring is arranged on a lower surface of a polishing pad to surround a substrate on an upper surface of the polishing pad to which slurry may be provided. The at least one slurry passage is formed in the retainer ring in a downward slant direction toward a central portion of the retainer ring to introduce the slurry to a space between the substrate and the polishing pad.