公开(公告)号：US11056769B2

公开(公告)日：2021-07-06

申请号：US16661033

申请日：2019-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunggil Jeon ,  Kyungwoo Lee ,  Joohyun Ahn

IPC: H01Q1/24 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q5/50

Abstract: An electronic device may include a housing including a conductive area, a first conductive member comprising a conductive material in electrical contact with the conductive area, a first wireless communication circuit electrically connected to the conductive area, and a second wireless communication circuit electrically connected to the first conductive member. The first wireless communication circuit transmits and/or receives a first signal having a frequency of 6 GHz or less using the conductive area, and the second wireless communication circuit transmits and/or receives a second signal having a frequency of 20 GHz or more using at least part of the first conductive member and the conductive area.