公开(公告)号：US20180174871A1

公开(公告)日：2018-06-21

申请号：US15838713

申请日：2017-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joong-Ha LEE ,  Sang-Yoon KIM ,  YoungBum KIM ,  Hui-Jae KIM ,  SeungDae SEOK ,  Jaebong SHIN ,  Byungjoon LEE ,  Yongin LEE ,  Jaeyeon PYO

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67144 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/681 ,  H01L21/6838 ,  H01L27/148

Abstract: A bonding apparatus includes a stage supporting a substrate, a first bonding head at a first side of the stage, the first bonding head to pick up a first chip and to bond the picked-up first chip onto the substrate, a second bonding head at a second side of the stage, the second bonding head to pick up a second chip and to bond the picked-up second chip onto the substrate, and a first image acquisition unit over a movement path of the stage to acquire an image of the stage.