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公开(公告)号:US11037760B2
公开(公告)日:2021-06-15
申请号:US16226786
申请日:2018-12-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hak-Young Kim , Bi-Ah Shin , Bo-Ra Yoon , Jun-Ho Im
IPC: C23C16/00 , H01L21/306 , H01J37/32 , F28F3/04 , G01K1/143
Abstract: A temperature controller of a plasma processing apparatus, a temperature measurer for a plasma processing apparatus, and a plasma processing apparatus, the temperature controller including a movable cooling plate configured to selectively contact a dielectric window in a plasma chamber, the cooling plate having at least one cooling groove through which a cooling agent for cooling the dielectric window is flowable; at least one cooling port including a cooling passageway that is connected to the at least one cooling groove; and a resilient member configured to resiliently press the cooling port toward the cooling plate such that the cooling plate is relatively movable with respect to the dielectric window.