公开(公告)号：US11037760B2

公开(公告)日：2021-06-15

申请号：US16226786

申请日：2018-12-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hak-Young Kim ,  Bi-Ah Shin ,  Bo-Ra Yoon ,  Jun-Ho Im

IPC: C23C16/00 ,  H01L21/306 ,  H01J37/32 ,  F28F3/04 ,  G01K1/143

Abstract: A temperature controller of a plasma processing apparatus, a temperature measurer for a plasma processing apparatus, and a plasma processing apparatus, the temperature controller including a movable cooling plate configured to selectively contact a dielectric window in a plasma chamber, the cooling plate having at least one cooling groove through which a cooling agent for cooling the dielectric window is flowable; at least one cooling port including a cooling passageway that is connected to the at least one cooling groove; and a resilient member configured to resiliently press the cooling port toward the cooling plate such that the cooling plate is relatively movable with respect to the dielectric window.