公开(公告)号：US20220005808A1

公开(公告)日：2022-01-06

申请号：US17476663

申请日：2021-09-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Won LEE ,  Hyuk-Woo KWON ,  Ik-Soo KIM ,  Byoung-Deog CHOI

IPC: H01L27/108 ,  H01L21/02 ,  H01L21/768 ,  H01L21/8234 ,  H01L21/311

Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the device including a substrate; a lower structure including pad patterns on the substrate, upper surfaces of the pad patterns being at an outer side of the lower structure; a plurality of lower electrodes contacting the upper surfaces of the pad patterns; a dielectric layer and an upper electrode sequentially stacked on a surface of each of the lower electrodes; and a hydrogen supply layer including hydrogen, the hydrogen supply layer being between the lower electrodes and closer to the substrate than the dielectric layer is to the substrate.

公开(公告)号：US20200152634A1

公开(公告)日：2020-05-14

申请号：US16420387

申请日：2019-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Won LEE ,  Hyuk-Woo KWON ,  Ik-Soo KIM ,  Byoung-Deog CHOI

IPC: H01L27/108 ,  H01L21/02 ,  H01L21/311 ,  H01L21/768

Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the device including a substrate; a lower structure including pad patterns on the substrate, upper surfaces of the pad patterns being at an outer side of the lower structure; a plurality of lower electrodes contacting the upper surfaces of the pad patterns; a dielectric layer and an upper electrode sequentially stacked on a surface of each of the lower electrodes; and a hydrogen supply layer including hydrogen, the hydrogen supply layer being between the lower electrodes and closer to the substrate than the dielectric layer is to the substrate.

公开(公告)号：US20180356864A1

公开(公告)日：2018-12-13

申请号：US16004725

申请日：2018-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Won LEE ,  Jang-Woon KIM ,  Chung-Ha KIM ,  Jae-Ho BAIK ,  Hyun-Keun SON ,  Seung-Ho JANG

IPC: G06F1/16 ,  E05D1/00 ,  E05D11/10

CPC classification number: G06F1/1681 ,  E05D1/00 ,  E05D11/105 ,  E05Y2201/46 ,  E05Y2600/13 ,  E05Y2900/606 ,  G06F1/1616 ,  G06F1/1649 ,  G06F1/1679

Abstract: An electronic device according to one embodiment may include: a first housing including a first side; a second housing including a second side facing the first side; at least one first magnetic member configured to be rotatably disposed inside the first housing and adjacent to the first side; and at least one second magnetic member configured to be rotatably disposed inside the second housing and adjacent to the second side, wherein the first housing and the second housing are rotatably coupled to each other by a magnetic force between the at least one first magnetic member and the at least one second magnetic member. Various other embodiments are also possible.