公开(公告)号：US20240412382A1

公开(公告)日：2024-12-12

申请号：US18654515

申请日：2024-05-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghoon JEE ,  Young Hun Sung ,  Dokwan Oh ,  Paul Oh ,  Junhee Lee ,  Dongwon Jang ,  Chansol Hwang

IPC: G06T7/246 ,  G06T7/70

Abstract: An image processing apparatus for performing motion estimation is provided. The image processing apparatus includes at least one processor configured to implement: a position estimation module configured to estimate an initial search position by providing a first frame and a second frame of a video as input to a neural network that is trained to output the initial search position; and a motion estimation module configured to perform motion estimation based on the initial search position.

公开(公告)号：US12231896B2

公开(公告)日：2025-02-18

申请号：US17751977

申请日：2022-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok Hong ,  Junhee Lee

IPC: H04W12/33 ,  H04W12/08 ,  H04W12/63

Abstract: An electronic apparatus is disclosed. The electronic apparatus includes: a communication interface comprising communication circuitry, and a processor configured to: identify strength of a signal received from an external device through the communication interface, based on the strength of the identified signal being greater than or equal to a threshold value, unlock authorization restriction on the electronic apparatus, wherein the processor is further configured to: based on the strength of the identified signal being less than the threshold value, maintain the authorization restriction, and based on authentication of the electronic apparatus being completed after the signal is received, adjust the threshold value based on strength of at least one signal received from the external device before the signal is received.

公开(公告)号：US10067180B2

公开(公告)日：2018-09-04

申请号：US14737506

申请日：2015-06-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhee Lee

IPC: G01R31/28

Abstract: Provided is a semiconductor device including a substrate, insulating layers on the substrate, interconnection lines in or between the insulating layers, and pads on the insulating layers. The pads may include signal pads connected to the interconnection lines, and measurement pads disposed spaced apart from the signal pads and electrically connected to corresponding ones of the signal pads by the interconnection lines. Misalignment of probes contacting the semiconductor device may be detected by detecting a signal communicated between one or more of the measurement pads and the signal pads.