公开(公告)号：US20220272688A1

公开(公告)日：2022-08-25

申请号：US17673260

申请日：2022-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junkyoung LEE ,  Ohseok KIM ,  Hasung KIM ,  Wijun LEE ,  Sangmin CHOI

IPC: H04W72/04 ,  H04W72/06 ,  H04W8/18 ,  H04L5/00 ,  H04W76/15 ,  H04L65/1016

Abstract: An operating method of a user equipment supporting dual subscriber identity module (SIM) dual active (DSDA), the method including performing a first communication with a first base station through a first network via radio frequency (RF) transmission paths allocated to a first SIM, the transmission paths being included in a set of RF transmission paths of the user equipment, determining whether the set of RF transmission paths includes more than the RF transmission paths in response to a resource allocation request from a second SIM, the resource allocation request corresponding to a second communication with a second base station through a second network, and allocating at least one of the RF transmission paths to each of the first SIM and the second SIM based on a time division multiplexing (TDM) scheme in response to determining the set of RF transmission paths does not include more than the RF transmission paths.

公开(公告)号：US20250046740A1

公开(公告)日：2025-02-06

申请号：US18637827

申请日：2024-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jubin SEO ,  Dongchan LIM ,  Sujeong PARK ,  Junkyoung LEE

IPC: H01L23/00 ,  H01L25/065

Abstract: A semiconductor chip structure includes a plurality of semiconductor chips. A bonding electrode included in each of the semiconductor chips is filled with nanotwin copper and fine grain copper is disposed in at least a portion of the bonding electrode.