公开(公告)号：US20250036299A1

公开(公告)日：2025-01-30

申请号：US18795406

申请日：2024-08-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAE-HOON CHOI ,  SANG-WAN NAM ,  SANGYONG YOON ,  KOOKHYUN CHO

IPC: G06F3/06

Abstract: A memory package includes a printed circuit board, a first memory device that is stacked on the printed circuit board, and a second memory device stacked on the first memory device. The first memory device includes a first one-time programmable (OTP) block, the second memory device includes a second OTP block different from the first OTP block, and a horizontal distance from one side of the first memory device to the first OTP block is different from a horizontal distance from one side of the second memory device to the second OTP block.