公开(公告)号：US20170229400A1

公开(公告)日：2017-08-10

申请号：US15417338

申请日：2017-01-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAE-HOON CHOI ,  DONG-WOO SHIN ,  CHANG-YONG PARK

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L24/08 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3025

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate. The semiconductor package further includes an electromagnetic wave shielding member. The electromagnetic wave shielding member includes an upper surface and a plurality of side surfaces. The electromagnetic wave shielding member surrounds an upper surface and side surfaces of the semiconductor chip. The semiconductor package further includes a hooking member formed from a deformation of a lower end of one of the side surfaces of the electromagnetic wave shielding member. The hooking member is interposed between the semiconductor chip and the substrate to fix the electromagnetic wave shielding member.

公开(公告)号：US20250036299A1

公开(公告)日：2025-01-30

申请号：US18795406

申请日：2024-08-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAE-HOON CHOI ,  SANG-WAN NAM ,  SANGYONG YOON ,  KOOKHYUN CHO

IPC: G06F3/06

Abstract: A memory package includes a printed circuit board, a first memory device that is stacked on the printed circuit board, and a second memory device stacked on the first memory device. The first memory device includes a first one-time programmable (OTP) block, the second memory device includes a second OTP block different from the first OTP block, and a horizontal distance from one side of the first memory device to the first OTP block is different from a horizontal distance from one side of the second memory device to the second OTP block.

公开(公告)号：US20230153000A1

公开(公告)日：2023-05-18

申请号：US18052285

申请日：2022-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAE-HOON CHOI ,  Sang-Wan Nam ,  Sangyong Yoon ,  Kookhyun Cho

IPC: G06F3/06

CPC classification number: G06F3/064 ,  G06F3/0604 ,  G06F3/0619 ,  G06F3/0679

Abstract: A memory package includes a printed circuit board, a first memory device that is stacked on the printed circuit board, and a second memory device stacked on the first memory device. The first memory device includes a first one-time programmable (OTP) block, the second memory device includes a second OTP block different from the first OTP block, and a horizontal distance from one side of the first memory device to the first OTP block is different from a horizontal distance from one side of the second memory device to the second OTP block.