公开(公告)号：US09903667B2

公开(公告)日：2018-02-27

申请号：US14255116

申请日：2014-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kan Tae Seo ,  Yong Ki Baek ,  Hayase Gaku

IPC: F28F13/12 ,  F28F1/12 ,  F28F9/02 ,  F28D1/053

CPC classification number: F28F1/12 ,  F28D1/05391 ,  F28F9/0204 ,  F28F9/0273 ,  F28F2255/00

Abstract: A distribution structure of a heat exchanger includes one inlet pipe connected to a header. The heat exchanger includes a first header having a first chamber and a second chamber, a second header having a third chamber and a fourth chamber, and a plurality of tubes arranged in a plurality of rows. An inlet pipe is connected to the first chamber and an outlet pipe is connected to the second chamber. A distributer distributes the refrigerant flowing into the first chamber to the tubes of the front row, the distributor includes a first separating baffle dividing the first chamber into a mixing chamber in which the refrigerant is mixed and a supplying chamber for supplying the refrigerant to the tubes, a distribution pipe communicating the mixing chamber with the supplying chamber, and a second separating baffle dividing the supplying chamber into a plurality of independent chambers.