公开(公告)号：US20140110851A1

公开(公告)日：2014-04-24

申请号：US14045648

申请日：2013-10-03

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Keun-Nam KIM ,  Sun-Young PARK ,  Soo-Ho SHIN ,  Kye-Hee YEOM ,  Hyeon-Woo JANG ,  Jin-Won JEONG ,  Chang-Hyun CHO ,  Hyeong-sun HONG

IPC分类号： H01L23/48

CPC分类号： H01L27/0207 ,  H01L23/48 ,  H01L23/528 ,  H01L23/5329 ,  H01L27/10814 ,  H01L27/10855 ,  H01L27/10885 ,  H01L27/10888 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes a plurality of bit lines that intersect an active region on a substrate and extend in a first direction, a contact pad formed on the active region between adjacent bit lines, and a plurality of spacers disposed on sidewalls of the plurality of bit lines. An upper portion of the contact pad is interposed between adjacent spacers, and a lower portion of the contact pad has a width greater than a distance between adjacent spacers.

摘要翻译： 半导体器件包括与衬底上的有源区相交并沿第一方向延伸的多个位线，形成在相邻位线之间的有源区上的接触焊盘和设置在多个位的侧壁上的多个间隔件 线条。 接触垫的上部插入在相邻间隔件之间，并且接触垫的下部具有大于相邻间隔件之间的距离的宽度。