公开(公告)号：US20140048208A1

公开(公告)日：2014-02-20

申请号：US13905825

申请日：2013-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ki-Seok KIM

IPC: H01L21/02

CPC classification number: H01L21/02057 ,  H01L21/6719 ,  H01L21/67207

Abstract: An apparatus for fabricating semiconductor devices including a load-lock part arranged adjacent to a front side of a transfer part, a cleaning part and at least two process chambers arranged side by side adjacent to a back side of the transfer part, a plasma supply module arranged at a back side of the cleaning part and configured to supply plasma to the cleaning part, and a reaction gas exhaust part coupled to the cleaning part and arranged below the transfer part and configured to exhaust a reaction gas from the cleaning part may be provided.

Abstract translation: 一种用于制造半导体器件的装置，包括邻近转印部分的前侧布置的加载锁定部分，清洁部分和与传送部分的背面并排布置的至少两个处理室，等离子体供应模块 布置在清洁部分的后侧并且被配置为将等离子体供应到清洁部分，并且可以提供耦合到清洁部分并且布置在传送部分下方并被配置为从清洁部分排出反应气体的反应气体排出部分 。

公开(公告)号：US20130213910A1

公开(公告)日：2013-08-22

申请号：US13671989

申请日：2012-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Ho KANG ,  Bong-Jin KUH ,  Ki-Seok KIM ,  Ki-Chul KIM ,  Ik-Soo KIM ,  Yong-Kyu JOO ,  Sang-Cheol HA

IPC: H01L21/683

CPC classification number: H01L21/683 ,  H01L21/67303 ,  H01L21/67309

Abstract: Provided is a boat for loading semiconductor substrates that includes a top plate and a bottom plate separated from each other, a rod extending from the bottom plate to the top plate and disposed between the top plate and the bottom plate, a plurality of buffer plates disposed between the top plate and the bottom plate and separated from each other by a first distance along a lengthwise direction of the rod, and a support provided between a first buffer plate and a second buffer plate which neighbor each other and supporting a loaded semiconductor substrate.

Abstract translation: 提供一种用于装载半导体基板的船，其包括彼此分离的顶板和底板，从底板延伸到顶板并设置在顶板和底板之间的杆，设置有多个缓冲板 在顶板和底板之间并且沿着杆的长度方向彼此分开第一距离，以及设置在彼此相邻并支撑加载的半导体衬底的第一缓冲板和第二缓冲板之间的支撑件。