公开(公告)号：US12153812B2

公开(公告)日：2024-11-26

申请号：US18052285

申请日：2022-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Hoon Choi ,  Sang-Wan Nam ,  Sangyong Yoon ,  Kookhyun Cho

IPC: G06F3/06

Abstract: A memory package includes a printed circuit board, a first memory device that is stacked on the printed circuit board, and a second memory device stacked on the first memory device. The first memory device includes a first one-time programmable (OTP) block, the second memory device includes a second OTP block different from the first OTP block, and a horizontal distance from one side of the first memory device to the first OTP block is different from a horizontal distance from one side of the second memory device to the second OTP block.

公开(公告)号：US20230153000A1

公开(公告)日：2023-05-18

申请号：US18052285

申请日：2022-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAE-HOON CHOI ,  Sang-Wan Nam ,  Sangyong Yoon ,  Kookhyun Cho

IPC: G06F3/06

CPC classification number: G06F3/064 ,  G06F3/0604 ,  G06F3/0619 ,  G06F3/0679

Abstract: A memory package includes a printed circuit board, a first memory device that is stacked on the printed circuit board, and a second memory device stacked on the first memory device. The first memory device includes a first one-time programmable (OTP) block, the second memory device includes a second OTP block different from the first OTP block, and a horizontal distance from one side of the first memory device to the first OTP block is different from a horizontal distance from one side of the second memory device to the second OTP block.