SUBSTRATE TREATING APPARATUSES AND METHODS OF REMOVING REACTION GAS USING THE SAME
    1.
    发明申请
    SUBSTRATE TREATING APPARATUSES AND METHODS OF REMOVING REACTION GAS USING THE SAME 审中-公开
    基板处理装置及其使用反应气体的方法

    公开(公告)号:US20130192648A1

    公开(公告)日:2013-08-01

    申请号:US13755367

    申请日:2013-01-31

    CPC classification number: B08B9/093 B08B9/08 C23C16/4405 C23C16/4412

    Abstract: A method of removing a reaction gas remaining in a process chamber after a process of treating a substrate in the process chamber is completed includes exhausting the reaction gas remaining in the process chamber to a region outside of the process chamber through an exhaust line, and supplying a cleaning gas into the process chamber through a gas supplying line. The cleaning gas is different from the reaction gas

    Abstract translation: 在处理室中处理基板的处理过程之后,除去残留在处理室中的反应气体的方法包括通过排气管将残留在处理室中的反应气体排出到处理室外部的区域,并供给 通过气体供应管线将清洁气体进入处理室。 清洗气体与反应气体不同

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