公开(公告)号：US20250062241A1

公开(公告)日：2025-02-20

申请号：US18653116

申请日：2024-05-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungdon MUN ,  Jihwang KIM ,  Sangjin BAEK ,  Kuwon LEE

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/427 ,  H01L25/18 ,  H10B80/00

Abstract: A semiconductor package includes: a first substrate; a bridge chip disposed on the first substrate and having a first region and a second region; an upper semiconductor chip disposed on the first region of the bridge chip; and conductive posts disposed on the second region of the bridge chip and spaced apart from the upper semiconductor chip, wherein the upper semiconductor chip is electrically connected to the conductive posts through the bridge chip.