公开(公告)号：US20200328105A1

公开(公告)日：2020-10-15

申请号：US16559762

申请日：2019-09-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Woo SUN ,  Sung Moon PARK ,  Je Woo HAN ,  Kwang Nam KIM ,  Ho Chang LEE ,  Young Hoon JEONG ,  Masayuki TOMOYASU

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: A substrate processing apparatus including a process chamber; a susceptor in the process chamber; and an inner edge ring and an outer edge ring on the susceptor, wherein the inner edge ring includes a semiconductor, the outer edge ring includes an insulator, an upper surface of the outer edge ring is at a higher level than an upper surface of the inner edge ring, and the outer edge ring has an overhang extending onto the inner edge ring.

公开(公告)号：US20210272838A1

公开(公告)日：2021-09-02

申请号：US17324229

申请日：2021-05-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Woo SUN ,  Sung Moon PARK ,  Je Woo HAN ,  Kwang Nam KIM ,  Ho Chang LEE ,  Young Hoon JEONG ,  Masayuki TOMOYASU

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: A substrate processing apparatus including a process chamber; a susceptor in the process chamber; and an inner edge ring and an outer edge ring on the susceptor, wherein the inner edge ring includes a semiconductor, the outer edge ring includes an insulator, an upper surface of the outer edge ring is at a higher level than an upper surface of the inner edge ring, and the outer edge ring has an overhang extending onto the inner edge ring.