公开(公告)号：US20140306727A1

公开(公告)日：2014-10-16

申请号：US14146119

申请日：2014-01-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungsook Lee ,  Jongpil Park ,  Kwon-Bon Koo ,  Moon-Seok Kim ,  Byoungjun Min

IPC: G01R31/26 ,  G01R31/3187

CPC classification number: G01R31/2868

Abstract: A test facility may be used to test semiconductor devices. The test facility may include a stacker part configured to communicate with a server, wherein the server includes test programs for testing semiconductor devices, and a plurality of test board parts disposed in the stacker part, at least one of the test board parts including semiconductor devices disposed thereon and configured to provide at least one of the test programs from the server to the semiconductor devices. The stacker part may include unit stackers which include shelves configured to hold the plurality of test board parts and a stacker controller configured to communicate with the test board parts in the unit stackers and the server.

Abstract translation: 测试设备可用于测试半导体器件。 测试设备可以包括配置成与服务器通信的堆叠器部件，其中服务器包括用于测试半导体器件的测试程序，以及设置在堆叠器部分中的多个测试板部件，至少一个测试板部件包括半导体器件 设置在其上并且被配置为提供从服务器到半导体器件的测试程序中的至少一个。 堆垛机部分可以包括单元堆垛机，其包括被配置为保持多个测试板部件的搁架和被配置为与单元堆垛机和服务器中的测试板部件通信的堆垛机控制器。