公开(公告)号：US20250029935A1

公开(公告)日：2025-01-23

申请号：US18605312

申请日：2024-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyuil Hwang ,  Minkyu Kim ,  Joongsun Kim ,  Pyunghwa Han

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L25/18

Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a lower redistribution substrate, an upper redistribution substrate, and a semiconductor chip between the lower redistribution substrate and the upper redistribution substrate. The lower redistribution substrate includes a lower dielectric structure, a lower redistribution pattern surrounded by the lower dielectric structure, and a lower shield structure surrounded by the lower dielectric structure and surrounding the lower redistribution pattern. The upper redistribution substrate includes an upper dielectric structure, an upper redistribution pattern surrounded by the upper dielectric structure, and an upper shield structure surrounded by the upper dielectric structure and surrounding the upper redistribution pattern.