公开(公告)号：US20130242705A1

公开(公告)日：2013-09-19

申请号：US13741907

申请日：2013-01-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Il KIM ,  Dong Wook KIM ,  Bae Hyung KIM ,  Jong Keun SONG ,  Seung Heun LEE ,  Kyung II CHO

IPC: H04R1/00 ,  H04R31/00

CPC classification number: H04R1/00 ,  B06B1/0292 ,  G10K11/004 ,  H04R31/00 ,  Y10T29/49005

Abstract: A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam.

Abstract translation: 多阵列型超声波探头装置包括发射和接收超声波束的n个瓦片; 以及分别安装有n个瓦片的n个引导部分的基板，以被排列成多阵列。 多阵列超声波探头装置可以在相同的方向和相同的水平上对齐瓦片，以控制发送和接收要在瓦片处发送和接收的超声波束的方向和时间，从而提供稳定的超声波束。

公开(公告)号：US20130289410A1

公开(公告)日：2013-10-31

申请号：US13870285

申请日：2013-04-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung II CHO ,  Dong Wook KIM

IPC: A61B8/00

CPC classification number: A61B8/4444 ,  A61B8/4477 ,  A61B8/4494 ,  B06B1/0622 ,  G01S15/8913 ,  G01S15/8925 ,  Y10T29/49005

Abstract: An ultrasonic probe apparatus and a method of manufacturing the ultrasonic probe apparatus are provided. The ultrasonic probe apparatus may include at least one first tile which transmits an ultrasonic beam toward a target object, and at least one second tile which receives an ultrasonic beam which is reflected from the target object.

Abstract translation: 提供一种超声波探伤装置及其制造方法。 超声波探伤装置可以包括至少一个第一瓦片，其将超声波束朝向目标物体传送，以及至少一个第二瓦片，其接收从目标物体反射的超声波束。