公开(公告)号：US12261107B2

公开(公告)日：2025-03-25

申请号：US17693867

申请日：2022-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Moongil Jung ,  Suhyeon Ku ,  Soyoen Park ,  Kyungsub Kim

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package includes a semiconductor chip; and a redistribution substrate connected to the semiconductor chip, the redistribution structure including a conductive structure including a lower conductive pattern and a redistribution structure on the lower conductive pattern and electrically connected to the lower conductive pattern, an insulating structure covering at least a side surface of the lower conductive pattern or a side surface of the redistribution structure, and a protective layer between the insulating structure and at least one of the lower conductive pattern or the redistribution structure. The protective layer including a first protective layer in contact with at least one of a side surface of the lower conductive pattern or a side surface of the redistribution structure, and a second protective layer in contact with at least a portion of a side surface of the first protective layer.

公开(公告)号：US11775009B2

公开(公告)日：2023-10-03

申请号：US17585562

申请日：2022-01-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungchul An ,  Myeongsil Park ,  Hyunho Shin ,  Shinhyuk Yoon ,  Kyungsub Kim

IPC: G06F1/16 ,  G06F3/0354

CPC classification number: G06F3/03545 ,  G06F1/1616 ,  G06F1/1684

Abstract: An electronic device includes: a display panel including a first area, a second area, and a third area bendable and between the first area and the second area a first support part under the display panel; a recognition member including a first recognition member under the first area, and a second recognition member spaced apart from the first recognition member and under the second area, where the recognition member is under the first support part and recognizes a signal of a pen input device; a second support part including a first portion under the first recognition member, and a second portion spaced apart from the first portion and under the second recognition member; a first printed circuit board electrically connected to the first portion; and a second printed circuit board spaced apart from the first printed circuit board and electrically connected to the second portion.