公开(公告)号：US20230253285A1

公开(公告)日：2023-08-10

申请号：US17959580

申请日：2022-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ying LI ,  Longhao PIAO

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L21/563 ,  H01L24/32 ,  H01L24/16 ,  H01L24/73 ,  H01L21/4882 ,  H01L24/11 ,  H01L23/3677 ,  H01L23/552

Abstract: Provided is a package structure, including a substrate, a chip on the substrate in a flip-chip manner, the chip including a circuit layer, and a side heat dissipator on a side of the chip, the side heat dissipator comprising a heat conduction material, wherein the side heat dissipator is electrically connected to the circuit layer.