公开(公告)号：US20180323094A1

公开(公告)日：2018-11-08

申请号：US15867068

申请日：2018-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MU YER LEE ,  Hyo Bum Kang ,  Jun Sung Lee ,  Jae Lyang Jung ,  Young Min Hur

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67288 ,  H01L21/6838

Abstract: A particle detection device includes a chuck stage on which a wafer is configured to be seated, first and second adsorption holes shaped as closed concentric curves passing through the chuck stage, a first adsorption module connected to the first adsorption hole under the chuck stage and configured to provide a vacuum pressure, a second adsorption module connected to the second adsorption hole under the chuck stage and configured to provide a vacuum pressure, a pressure gauge configured to measure vacuum pressures of the first and second adsorption holes and a detection module configured to receive the vacuum pressures of the first and second adsorption holes from the pressure gauge and detect whether the wafer is fixed or not and whether particle is present or not, based on the received vacuum pressures. The first and second adsorption modules sequentially provide the vacuum pressure to the first and second adsorption holes.