公开(公告)号：US11016143B2

公开(公告)日：2021-05-25

申请号：US16426112

申请日：2019-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mee-hyun Lim ,  Sung-yeol Kim ,  Jae-hong Kim ,  Taek-jin Kim ,  Kyung-min Lee

IPC: G01R31/308

Abstract: An apparatus for testing a wiring circuit includes: a circuit substrate having wirings in the circuit substrate and pads on an upper surface of the circuit substrate and connected to the wirings; an electrode below a lower surface of the circuit substrate; an optical sensor above the upper surface of the circuit substrate and configured to detect a signal emitted from the upper surface of the circuit substrate; and an optical unit above the optical sensor and configured to irradiate light, wherein the optical sensor includes: an optical substrate whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate; and a patterned reflective layer on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region reflecting light incident on the optical substrate and a second region transmitting the light incident on the optical substrate.