Apparatus and method of testing a wiring circuit

    公开(公告)号:US11016143B2

    公开(公告)日:2021-05-25

    申请号:US16426112

    申请日:2019-05-30

    Abstract: An apparatus for testing a wiring circuit includes: a circuit substrate having wirings in the circuit substrate and pads on an upper surface of the circuit substrate and connected to the wirings; an electrode below a lower surface of the circuit substrate; an optical sensor above the upper surface of the circuit substrate and configured to detect a signal emitted from the upper surface of the circuit substrate; and an optical unit above the optical sensor and configured to irradiate light, wherein the optical sensor includes: an optical substrate whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate; and a patterned reflective layer on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region reflecting light incident on the optical substrate and a second region transmitting the light incident on the optical substrate.

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