公开(公告)号：US11152304B2

公开(公告)日：2021-10-19

申请号：US16580153

申请日：2019-09-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Hun Lee ,  Sang Jin Lee ,  Min-Sek Jang

IPC: H01L23/528 ,  H01L23/522 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes a frame including wiring layers and having a recess portion in which a stopper layer is disposed on a bottom surface, a semiconductor chip having an active surface and an inactive surface, the inactive surface being disposed in the recess portion and facing the stopper layer, a first connection portion on the connection pad, a second connection portion on the uppermost wiring layer, a stiffener on the upper surface of the frame and surround at least a portion of the second connection portion, the stiffener being spaced apart from second connection portion, an encapsulant covering at least portions of each of the frame and the semiconductor chip, and filling at least a portion of the recess portion, and a connection structure on the frame and the semiconductor chip, and including a redistribution layer electrically connected to the first and second connection portions.