Electroluminescent device, and display device comprising the same

    公开(公告)号:US11038112B2

    公开(公告)日:2021-06-15

    申请号:US16203988

    申请日:2018-11-29

    IPC分类号: H01L51/50 H01L51/00 H01L51/52

    摘要: An electroluminescent device and a display device includes the same are disclosed. The electroluminescent device includes a first electrode; a hole transport layer disposed on the first electrode and including a first organic material having a conjugated structure; an emission layer disposed directly on the hole transport layer and including a plurality of light emitting particles; an electron transport layer disposed on the emission layer; and a second electrode disposed on the electron transport layer, wherein at least one of the light emitting particles includes a core and a hydrophilic ligand attached to a surface of the core, wherein the hole transport layer has a first thickness and a second thickness at any two point locations, and the first thickness and the second thickness satisfy Equation 1.
    Equation 1 is described in the detailed description.

    Fan-out semiconductor package
    4.
    发明授权

    公开(公告)号:US10672714B2

    公开(公告)日:2020-06-02

    申请号:US15928845

    申请日:2018-03-22

    摘要: A fan-out semiconductor package includes: a first semiconductor chip having an active surface having first connection pads disposed thereon and an inactive surface opposing the active surface; a second semiconductor chip having an active surface having second connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of each of the first and second semiconductor chips; and a connection member disposed on the active surface of each of the first and second semiconductor chips and including a redistribution layer electrically connected to the first and second connection pads, wherein the first and second semiconductor chips are physically integrated with each other, and the first and second semiconductor chips have internal circuits, respectively.

    Quantum dot device and electronic device

    公开(公告)号:US10446781B2

    公开(公告)日:2019-10-15

    申请号:US16001227

    申请日:2018-06-06

    摘要: A quantum dot device includes an anode, a hole injection layer on the anode, a hole transport layer on the hole injection layer, a quantum dot layer on the hole transport layer, and a cathode on the quantum dot layer, wherein a highest occupied molecule orbital (HOMO) energy level of the quantum dot layer is greater than or equal to about 5.6 electronvolts (eV), a difference between a HOMO energy level of the hole transport layer and the highest occupied molecule orbital energy level of the quantum dot layer is less than about 0.5 eV, the hole injection layer has a first surface contacting the anode and a second surface contacting the hole transport layer, and a HOMO energy level of the first surface of the hole injection layer is different from a HOMO energy level of the second surface of the hole injection layer.

    Semiconductor package
    9.
    发明授权

    公开(公告)号:US11152304B2

    公开(公告)日:2021-10-19

    申请号:US16580153

    申请日:2019-09-24

    摘要: A semiconductor package includes a frame including wiring layers and having a recess portion in which a stopper layer is disposed on a bottom surface, a semiconductor chip having an active surface and an inactive surface, the inactive surface being disposed in the recess portion and facing the stopper layer, a first connection portion on the connection pad, a second connection portion on the uppermost wiring layer, a stiffener on the upper surface of the frame and surround at least a portion of the second connection portion, the stiffener being spaced apart from second connection portion, an encapsulant covering at least portions of each of the frame and the semiconductor chip, and filling at least a portion of the recess portion, and a connection structure on the frame and the semiconductor chip, and including a redistribution layer electrically connected to the first and second connection portions.