-
公开(公告)号:US20170025461A1
公开(公告)日:2017-01-26
申请号:US15285018
申请日:2016-10-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yun-Ki LEE , Chang-Rok MOON , Min-Wook JUNG
IPC: H01L27/146
CPC classification number: H01L27/14623 , H01L27/14607 , H01L27/14609 , H01L27/1463 , H01L27/14636 , H01L27/1464 , H01L27/14643 , H01L27/14687
Abstract: An image sensor is provided. The image sensor includes a substrate, a first interlayer insulating layer, a first metal line, and a shielding structure. The substrate includes a pixel array, a peripheral circuit area, and an interface area disposed between the pixel array and the peripheral circuit area. The first interlayer insulating layer is formed on a first surface of the substrate. The first metal line is disposed on the first interlayer insulating layer of the pixel array. The second interlayer insulating layer is disposed on the first interlayer insulating layer wherein the second interlayer insulating layer covers the first metal line. The shielding structure passes through the substrate in the interface area wherein the shielding structure electrically insulates the pixel array of the substrate and the peripheral circuit area.
Abstract translation: 提供图像传感器。 图像传感器包括基板,第一层间绝缘层,第一金属线和屏蔽结构。 衬底包括像素阵列,外围电路区域和布置在像素阵列和外围电路区域之间的接口区域。 第一层间绝缘层形成在基板的第一表面上。 第一金属线设置在像素阵列的第一层间绝缘层上。 第二层间绝缘层设置在第一层间绝缘层上,其中第二层间绝缘层覆盖第一金属线。 屏蔽结构通过衬底在屏蔽结构中电绝缘衬底的像素阵列和外围电路区域的界面区域中。