公开(公告)号：US12302049B2

公开(公告)日：2025-05-13

申请号：US18106283

申请日：2023-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeong Woo ,  Minsik Lim ,  Jungchul An

IPC: H04R1/04 ,  H04M1/02 ,  H04N23/51 ,  H04N23/52 ,  H04R1/02 ,  H04R1/08 ,  H04R3/00 ,  H05K1/18 ,  H05K7/14

Abstract: In an electronic device, at least a portion of a camera cover member is disposed inside a housing. The camera cover member includes a through-hole in fluid communication with the outside of the housing, and is formed to support a camera module disposed inside the housing. A microphone module is disposed inside the housing so as to be adjacent to the camera module, and includes a first circuit board disposed on the camera cover member and a microphone disposed on the first circuit board. A second circuit board is disposed to face the camera cover member with the microphone module therebetween, and includes a contact structure in contact with the first circuit board. The contact structure is configured to electrically connect the first circuit board to the second circuit board and can be disposed between the first circuit board and the second circuit board to surround the microphone.