公开(公告)号：US20140213002A1

公开(公告)日：2014-07-31

申请号：US14163587

申请日：2014-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myong-soo CHO ,  Myeong-rak SON ,  Young-chul SHIN ,  Seung-hwan LEE

IPC: H01L33/48

CPC classification number: H01L33/0079 ,  H01L33/0095 ,  H01L2933/0033

Abstract: A method for manufacturing a light emitting device package is provided. In the method, a growth substrate including a plurality of light emitting devices disposed on a top surface of the growth substrate is prepared. A first package substrate having a bonding pattern corresponding to a portion of the plurality of light emitting devices is prepared, and the bonding pattern is disposed on a top surface of the first package substrate. The portion of the plurality of light emitting devices and the bonding pattern are bonded by disposing the top surface of the growth substrate to face the top surface of the first package substrate. The portion of the plurality of light emitting devices is separated from the growth substrate. The portion of the plurality of light emitting devices joined to the bonding pattern is packaged.

Abstract translation: 提供一种制造发光器件封装的方法。 在该方法中，制备包括设置在生长衬底的顶表面上的多个发光器件的生长衬底。 准备具有与多个发光元件的一部分对应的接合图案的第一封装基板，并且接合图案设置在第一封装基板的顶面上。 通过将生长衬底的顶表面设置为面对第一封装衬底的顶表面，多个发光器件的部分和接合图案被接合。 多个发光器件的部分与生长衬底分离。 连接到接合图案的多个发光器件的部分被封装。