公开(公告)号：US10332865B2

公开(公告)日：2019-06-25

申请号：US15478541

申请日：2017-04-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun Kim ,  Jae Jun Bang ,  Chang Ho Shin ,  Dong Soo Lee ,  Seog Ho Lim ,  Myoung Sun Ha

IPC: H01L25/00 ,  H01L33/62 ,  H01L25/075

Abstract: A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.