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公开(公告)号：US20230039410A1
公开(公告)日：2023-02-09
申请号：US17730336
申请日：2022-04-27
发明人： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
摘要： A semiconductor ultraviolet light emitting device package is provided. The semiconductor ultraviolet light emitting device package includes: a semiconductor ultraviolet light emitting device mounted on the first surface of the package substrate and configured to emit deep ultraviolet light including a wavelength in a range of 250 nm to 285 nm; a reflector disposed on the first surface of the package substrate to surround the semiconductor ultraviolet light emitting device, and including an inclined sidewall that defines an opening of the reflector, the semiconductor ultraviolet light emitting device disposed within the opening; and a light transmitting cover including a lower surface covering the opening and an upper surface opposite to the lower surface, wherein an antireflective layer is disposed on at least one from among the lower surface and the upper surface.
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公开(公告)号：US10529699B2
公开(公告)日：2020-01-07
申请号：US15581879
申请日：2017-04-28
发明人： Jae-jun Bang , Seog-ho Lim , Chang-ho Shin , Dong-soo Lee , Sun Kim
IPC分类号： H01L27/15 , H01L25/13 , F21V8/00 , H01L33/48 , H01L33/56 , H01L25/075 , H01L33/50 , H01L33/60 , H01L33/38
摘要： Provided are a light source module and a backlight unit (BLU) including the same. The light source module includes a substrate including a base plate extending in a first direction and a pair of dam structures stacked on opposing sides of the base plate along a second direction, orthogonal to the first direction, and extending along the base plate in the first direction, wherein the pair of dam structures are spaced apart from each other along a third direction, orthogonal to the first and second directions. A plurality of light-emitting devices are mounted on the substrate between the pair of dam structures and spaced apart from one another in the first direction. An encapsulation layer covers at least one side surface and a top surface of each of the plurality of light-emitting devices. A height of the pair of dam structures is greater than a height of the encapsulation layer.
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公开(公告)号：US20230011141A1
公开(公告)日：2023-01-12
申请号：US17689026
申请日：2022-03-08
发明人： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
摘要： A semiconductor light emitting device package includes a circuit board with an upper pad, a light emitting diode chip on the circuit board and having a first surface facing the circuit board and a second surface opposing the first surface, and the light emitting diode chip including a substrate, a semiconductor stack structure on the substrate that emits ultraviolet light, and electrodes connected to the semiconductor stack structure, connection bumps between the circuit board and the light emitting diode chip, the connection bumps connecting the upper pad and the electrodes, an underfill resin on the upper pad of the circuit board and covering at least a portion of a side surface of the light emitting diode chip, and a passivation layer on the light emitting diode chip and the underfill resin, the passivation layer covering the underfill resin and being spaced apart from the semiconductor stack structure.
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公开(公告)号：US10332865B2
公开(公告)日：2019-06-25
申请号：US15478541
申请日：2017-04-04
发明人： Sun Kim , Jae Jun Bang , Chang Ho Shin , Dong Soo Lee , Seog Ho Lim , Myoung Sun Ha
IPC分类号： H01L25/00 , H01L33/62 , H01L25/075
摘要： A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.
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公开(公告)号：US12125954B2
公开(公告)日：2024-10-22
申请号：US17689026
申请日：2022-03-08
发明人： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
CPC分类号： H01L33/56 , H01L25/13 , H01L33/06 , H01L33/32 , H01L33/44 , H01L33/486 , H01L33/62 , H01L2933/0025 , H01L2933/005
摘要： A semiconductor light emitting device package includes a circuit board with an upper pad, a light emitting diode chip on the circuit board and having a first surface facing the circuit board and a second surface opposing the first surface, and the light emitting diode chip including a substrate, a semiconductor stack structure on the substrate that emits ultraviolet light, and electrodes connected to the semiconductor stack structure, connection bumps between the circuit board and the light emitting diode chip, the connection bumps connecting the upper pad and the electrodes, an underfill resin on the upper pad of the circuit board and covering at least a portion of a side surface of the light emitting diode chip, and a passivation layer on the light emitting diode chip and the underfill resin, the passivation layer covering the underfill resin and being spaced apart from the semiconductor stack structure.
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公开(公告)号：US10509159B2
公开(公告)日：2019-12-17
申请号：US15407641
申请日：2017-01-17
发明人： Dong-soo Lee , Seog-ho Lim , Chang-ho Shin , Sun Kim , Myoung-sun Ha , Jae-jun Bang
IPC分类号： H01L25/075 , F21V8/00 , F21V19/00 , F21V23/06 , H01L33/50 , H01L33/62 , F21Y115/10 , H01L33/48
摘要： A light source module according to some example embodiments includes a first substrate and a plurality of second substrates. The first substrate includes a plurality of connectors configured to at least receive a supply of electrical power and a plurality of first connection pads that are configured to be electrically connected to the plurality of connectors. The second substrates each include a plurality of mounting elements on an upper surface and a plurality of second connection pads on a lower surface of the second substrate and configured to be electrically connected to the plurality of mounting elements. Each mounting element may be connected to a separate light-emitting device. A plurality of connection members may electrically connect the first connection pads of the first substrate to the plurality of second connection pads of the plurality of second substrates.
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