公开(公告)号：US20190165478A1

公开(公告)日：2019-05-30

申请号：US16199855

申请日：2018-11-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hoon JO ,  Su Min YUN ,  Myung Hun JEONG ,  Je Hun JONG ,  Se Hyun PARK ,  Jae Bong CHUN

IPC: H01Q9/28 ,  H01Q19/24 ,  H01Q21/06 ,  H01Q21/24 ,  H01Q3/24

Abstract: An electronic device includes a first conductive plate, a second conductive plate that is spaced from the first conductive plate and is disposed parallel to the first conductive plate, a conductive element that is disposed in a space between the first conductive plate and the second conductive plate, a wireless communication circuit that is electrically connected with the first conductive plate and the conductive element, and a printed circuit board that is coupled with at least one side of the first conductive plate, at least one side of the second conductive plate, and one end of the conductive element. The wireless communication circuit is configured to transmit/receive a first radio frequency (RF) signal having a vertical polarization characteristic using the first conductive plate and the second conductive plate and to transmit/receive a second RF signal having a horizontal polarization characteristic using the conductive element.

公开(公告)号：US20190229413A1

公开(公告)日：2019-07-25

申请号：US16199784

申请日：2018-11-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Je Hun JONG ,  Se Hyun PARK ,  Su Min YUN ,  Myung Hun JEONG ,  Jae Hoon JO ,  Jin Woo JUNG ,  Jae Bong CHUN

IPC: H01Q1/42 ,  H01Q1/38 ,  H01Q19/13 ,  H01Q21/00 ,  H01Q11/14 ,  H01Q1/52

Abstract: An electronic device includes a housing that includes a first plate, a second plate facing a direction opposite the first plate, and a side member surrounding a space between the first plate and the second plate, an antenna structure that includes a plurality of dielectric layers perpendicular to the side member and parallel to the first plate, a first array of conductive plates aligned in a first direction perpendicular to the first plate at a first dielectric layer of the dielectric layers, a second array of conductive plates spaced from the first array and aligned in the first direction at the first dielectric layer, wherein the second array is farther from the first plate than the first array, at least one ground plane positioned on at least one of the dielectric layers and interposed between the first array and the second array, when viewed from above the side member, and a wireless communication circuit electrically connected to the first array and the second array and configured to transmit and/or receive a signal having a frequency in a range of 20 GHz to 100 GHz.