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公开(公告)号：US20220068895A1
公开(公告)日：2022-03-03
申请号：US17236138
申请日：2021-04-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： SANGSOO KIM , SEHUN AHN , Pilsung CHOI , SUNG-KYU PARK
Abstract: A semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface. A semiconductor chip is on the first surface of the substrate. A passive element is on the second surface of the substrate. The substrate includes a first passive element pad and a second passive element pad that are exposed by the second surface. A dam extends downwardly from the second surface. The dam includes a first dam and a second dam. The passive element is disposed between the first dam and the second dam. The passive element includes a first electrode portion electrically connected to the first passive element pad. A second electrode portion is electrically connected to the second passive element pad.
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公开(公告)号：US20210366832A1
公开(公告)日：2021-11-25
申请号：US17392705
申请日：2021-08-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： JONGHO PARK , SEUNG HWAN KIM , JUN YOUNG OH , Kyong Hwan KOH , SANGSOO KIM , DONG-JU JANG
IPC: H01L23/538 , H01L25/065 , H01L23/16 , H01L23/31
Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.
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