公开(公告)号：US20230081723A1

公开(公告)日：2023-03-16

申请号：US17804742

申请日：2022-05-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JU HYUNG LEE ,  DONG UK KWON ,  SUN CHUL KIM ,  YONG HYUN KIM ,  MIN JAE LEE

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538

Abstract: A method of fabricating a semiconductor package includes disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate to which a pad part is attached, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer. A bonding tool is disposed on the interposer. The bonding tool includes a first region and a second region outside of the first region. The second region of the bonding tool corresponds to the pad part. The interposer and the substrate are bonded to each other.