公开(公告)号：US20240151664A1

公开(公告)日：2024-05-09

申请号：US18241570

申请日：2023-09-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Eun KIM ,  Sewon KIM ,  SEO YOUNG PARK ,  JEONGHO AHN ,  SUNGEUN LEE

IPC: G01N23/2251 ,  H01J37/06 ,  H01J37/147 ,  H01J37/244 ,  H01J37/28

CPC classification number: G01N23/2251 ,  H01J37/06 ,  H01J37/1472 ,  H01J37/244 ,  H01J37/28

Abstract: A method of inspecting a substrate includes providing a substrate on a test stage, the substrate including a plurality of regions, and scanning the substrate using a scanning electron microscope (SEM) column, where the scanning of the substrate includes scanning a first region of the plurality of regions of the substrate, after scanning the first region, scanning a second region of the plurality of regions of the substrate, the second region being spaced apart from the first region, and after scanning the second region, scanning a third region of the plurality of regions of the substrate, the third region being between the first region and the second region, and where the third region is adjacent to the first region.