公开(公告)号：US20200231610A1

公开(公告)日：2020-07-23

申请号：US16554926

申请日：2019-08-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Min RYU ,  Myong Woon KIM ,  Younsoo KIM ,  Sang Ick LEE ,  Jaesoon LIM ,  Younjoung CHO ,  Jun Hee CHO ,  Won Mook CHAE

IPC: C07F7/22 ,  C23C16/40 ,  C23C16/448 ,  H01L21/02 ,  H01L21/285

Abstract: A tin compound, a tin precursor compound for forming a tin-containing layer, and a method of forming a thin layer, the tin compound being represented by Formula 1: wherein R1, R2, R3, R4, R5, R6, and R7 are each independently hydrogen, a linear alkyl group having 1 to 4 carbon atoms, or a branched alkyl group having 3 or 4 carbon atoms.