公开(公告)号：US20190113324A1

公开(公告)日：2019-04-18

申请号：US15942876

申请日：2018-04-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-ho Hwang ,  Sang-yoon Soh ,  Dae-hee Lee ,  Dae-sung Jung ,  Dong-ouk Kim ,  Jong-min Song

IPC: G01B7/00 ,  H01L21/67 ,  G01R29/12 ,  G01P15/08

Abstract: A sensor module for detecting a process environment in semiconductor equipment includes: a sensor body including a first plate and a second plate; and a sensor circuit unit in the sensor body, wherein the sensor circuit unit comprises a static electricity sensor between the first plate and the second plate.