公开(公告)号：US10756059B2

公开(公告)日：2020-08-25

申请号：US16157642

申请日：2018-10-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwanyeob Chae ,  Sanghoon Joo ,  Jong-Ryun Choi ,  Jin-Ho Choi

IPC: H01L25/065 ,  H01L23/50 ,  H01L23/58 ,  H01L23/60 ,  H01L23/00 ,  H01L23/528 ,  H01L23/522

Abstract: A semiconductor chip including a plurality of input/output units includes: a plurality of additional pads disposed on a surface of the semiconductor chip, wherein the plurality of additional pads include at least one of a first additional pad to which a ground voltage is applied and a second additional pad to which a power supply voltage is applied; and a plurality of pads disposed on the surface of the semiconductor chip, wherein the plurality of pads include at least one of a first pad to which the ground voltage is applied and a second pad to which the power supply voltage is applied, and further include a third pad through which a signal is input and/or output. The at least one of the first additional pad and the second additional pad is disposed on an input/output unit where the third pad is disposed, among the plurality of input/output units.

公开(公告)号：US10115706B2

公开(公告)日：2018-10-30

申请号：US15277339

申请日：2016-09-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwanyeob Chae ,  Sanghoon Joo ,  Jong-Ryun Choi ,  Jin-Ho Choi

IPC: H01L23/58 ,  H01L25/065 ,  H01L23/50 ,  H01L23/60 ,  H01L23/00

Abstract: A semiconductor chip including a plurality of input/output units includes: a plurality of additional pads disposed on a surface of the semiconductor chip, wherein the plurality of additional pads include at least one of a first additional pad to which a ground voltage is applied and a second additional pad to which a power supply voltage is applied; and a plurality of pads disposed on the surface of the semiconductor chip, wherein the plurality of pads include at least one of a first pad to which the ground voltage is applied and a second pad to which the power supply voltage is applied, and further include a third pad through which a signal is input and/or output. The at least one of the first additional pad and the second additional pad is disposed on an input/output unit where the third pad is disposed, among the plurality of input/output units.