Semiconductor chip including a plurality of pads

    公开(公告)号:US10756059B2

    公开(公告)日:2020-08-25

    申请号:US16157642

    申请日:2018-10-11

    Abstract: A semiconductor chip including a plurality of input/output units includes: a plurality of additional pads disposed on a surface of the semiconductor chip, wherein the plurality of additional pads include at least one of a first additional pad to which a ground voltage is applied and a second additional pad to which a power supply voltage is applied; and a plurality of pads disposed on the surface of the semiconductor chip, wherein the plurality of pads include at least one of a first pad to which the ground voltage is applied and a second pad to which the power supply voltage is applied, and further include a third pad through which a signal is input and/or output. The at least one of the first additional pad and the second additional pad is disposed on an input/output unit where the third pad is disposed, among the plurality of input/output units.

    Interface circuit for multi rank memory

    公开(公告)号:US10586575B2

    公开(公告)日:2020-03-10

    申请号:US16211777

    申请日:2018-12-06

    Abstract: An electronic circuit including: a first delay line circuit to generate a first data strobe by delaying a second data strobe, such that an edge of the first data strobe is aligned within a first time interval; and a sampling circuit to sample the first data signal at the edge of the first data strobe, wherein plural data signals include the first data signal and a second data signal, wherein timings of the plural data signals deviate from a reference timing of a reference data strobe by plural time lengths, wherein the first data signal deviates from the reference timing by a first time length of the plural time lengths, and wherein an edge of the second data strobe is aligned within a second time interval, wherein a timing of the second data signal deviates from the reference timing by a shortest time length of the plural time lengths.

    Semiconductor chip including a plurality of pads

    公开(公告)号:US10115706B2

    公开(公告)日:2018-10-30

    申请号:US15277339

    申请日:2016-09-27

    Abstract: A semiconductor chip including a plurality of input/output units includes: a plurality of additional pads disposed on a surface of the semiconductor chip, wherein the plurality of additional pads include at least one of a first additional pad to which a ground voltage is applied and a second additional pad to which a power supply voltage is applied; and a plurality of pads disposed on the surface of the semiconductor chip, wherein the plurality of pads include at least one of a first pad to which the ground voltage is applied and a second pad to which the power supply voltage is applied, and further include a third pad through which a signal is input and/or output. The at least one of the first additional pad and the second additional pad is disposed on an input/output unit where the third pad is disposed, among the plurality of input/output units.

Patent Agency Ranking