公开(公告)号：US11467205B2

公开(公告)日：2022-10-11

申请号：US17338312

申请日：2021-06-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoonwoo Kim ,  Jaehun Lee ,  Taejun Park ,  Sanghun Lim ,  Seokyung Kim ,  Junnyeon Jeong

IPC: G01R31/28 ,  G01R31/00 ,  G01R1/04

Abstract: A substrate testing apparatus configured to perform a hot electron analysis (HEA) test for analyzing a stand-by failure in a substrate includes a heating chuck having a first surface configured to support the substrate and a second surface opposite to the first surface. The heating chuck is configured to heat the substrate and has an aperture passing through the first surface and the second surface. A substrate moving device moves the substrate on the heating chuck in a lateral direction. A camera is under the heating chuck and photographs the substrate, which is exposed by the heating chuck aperture.