公开(公告)号：US10804120B2

公开(公告)日：2020-10-13

申请号：US15652345

申请日：2017-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seong-Moon Ha ,  Min-Kyu Sung ,  Seung-Hee Cho ,  Seong-Chul Choi ,  Kyung-Sun Kim ,  Sang-Ho Lee

IPC: H01L21/67 ,  H01J37/32 ,  C23C16/44

Abstract: A temperature controller of a plasma-processing apparatus including a heating unit and a cooling unit. The heating unit is configured to heat a liner on an inner surface of a plasma chamber in which a plasma is formed. The cooling unit is configured to cool the liner to controls a temperature of an upper electrode in the plasma chamber.