-
公开(公告)号:US20230275193A1
公开(公告)日:2023-08-31
申请号:US18088226
申请日:2022-12-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Soonmin HONG , Gunwoo KIM , Seonghwan SHIN , Tackmo LEE
CPC classification number: H01L33/483 , H01L25/167 , H01L24/32
Abstract: A display module includes: a substrate; a side wiring extending along a side surface of the substrate, the side wiring electrically connecting a TFT layer of the substrate at a first end of the side wiring with a rear wiring layer of the substrate at a second end of the side wiring; a front cover disposed on and bonded with a mounting surface of the substrate; a metal plate disposed on and bonded with the rear surface; a side cover covering the side wiring and the side surface; a waterproof member configured to seal the second end of the side wiring from outside and prevent moisture permeation; and a side end member disposed on and covering the side cover and the waterproof member, and the side end member being grounded to the metal plate.
-
公开(公告)号:US20230027649A1
公开(公告)日:2023-01-26
申请号:US17745458
申请日:2022-05-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Soonmin HONG , Seonghwan SHIN , Tackmo LEE , Hyeongik KIM
IPC: H01L27/15 , H01L33/62 , H01L25/075
Abstract: A display module includes a substrate including a mounting surface and a side surface; a Thin Film Transistor (TFT) layer provided on the mounting surface of the substrate; a plurality of inorganic light emitting diodes mounted on the mounting surface of the substrate; an anisotropic conductive layer provided on an upper surface of the TFT layer and electrically connecting the TFT layer to the plurality of inorganic light emitting diodes; a front cover covering the mounting surface; and a side cover surrounding the side surface. A side end of the front cover extends to a region outside the mounting surface, the side cover is bonded to a lower surface of the front cover and to the side surface of the substrate which correspond to the region outside of the mounting surface, and a side end of the anisotropic conductive layer is provided on an inner side with respect to the side end of the front cover.
-
公开(公告)号:US20220084994A1
公开(公告)日:2022-03-17
申请号:US17533896
申请日:2021-11-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seonghwan SHIN
Abstract: A display module includes a substrate including a mounting surface on which a plurality of inorganic LEDs are mounted and a side surface orthogonal to the mounting surface; a cover which is disposed on the mounting surface, and is configured to cover the mounting surface and extend to an area outside the mounting surface; and a side surface member provided on the side surface, and configured to be bonded to a lower surface of a region of the cover that corresponds to the area outside the mounting surface and to at least a part of the side surface.
-
公开(公告)号:US20220199594A1
公开(公告)日:2022-06-23
申请号:US17561084
申请日:2021-12-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seonghwan SHIN , Sungsoo JUNG , Hyeongik KIM , Yonghan YOON , Kwangjae LEE , Chiwoo LEE
IPC: H01L25/13 , H01L25/075 , H01L33/62
Abstract: Provided is a display module including: a substrate including a mounting surface on which a plurality of inorganic light emitting diodes (LEDs) are mounted, a side surface, and a rear surface disposed opposite to the mounting surface; a front cover bonded to and covering the mounting surface; a metal plate bonded to the rear surface; and a side cover configured to surround the side surface, wherein the front cover extends to an area outside of the mounting surface in a first direction in which the mounting surface extends, and wherein the side cover is provided to extend, in a second direction in which the mounting surface faces, from an upper side of the metal plate to a lower end of a region of the front cover to seal the side surface from an outside.
-
公开(公告)号:US20210183837A1
公开(公告)日:2021-06-17
申请号:US17119047
申请日:2020-12-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seonghwan SHIN , Sungsoo JUNG , Pilyong OH , Kwangjae LEE , Jeongin HAN
IPC: H01L25/16
Abstract: A display module may include: (1) a substrate including a mounting surface on which a thin film transistor (TFT) layer is formed, a side surface, and a chamfer portion formed between the mounting surface and the side surface; (2) a plurality of inorganic light emitting diodes (LEDs) disposed on the TFT layer, each of the plurality of inorganic LEDs including a pair of electrodes electrically connected to the TFT layer and disposed to face the mounting surface, and a light emitting surface configured to emit light in a first direction opposite to a second direction that extends from the plurality of inorganic LEDs to the mounting surface of the substrate; and (3) a molding provided to cover the plurality of inorganic LEDs, the chamfer portion of the substrate, and the side surface of the substrate.
-
公开(公告)号:US20250031497A1
公开(公告)日:2025-01-23
申请号:US18906800
申请日:2024-10-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seonghwan SHIN , Gunwoo KIM , Tackmo LEE , Soonmin HONG
IPC: H01L33/56 , H01L25/075 , H01L25/16 , H01L27/15
Abstract: A display module includes: a substrate including a mounting surface having a thin-film transistor (TFT) layer is formed thereon, a side surface, and a rear surface opposite to the mounting surface; a plurality of inorganic light-emitting elements mounted on the mounting surface; an anisotropic conductive layer on the TFT layer and configured to electrically connect the TFT layer with the plurality of inorganic light-emitting elements; a front cover for covering the mounting surface; a side cover for surrounding the side surface; and a metal plate adhered to the rear surface. A side end of the front cover extends to a region outside the mounting surface. The side cover is made of a moisture-proof material for preventing moisture from permeating, and extends to at least a part of a side surface of the metal plate from a lower portion of the front cover corresponding to the region outside the mounting surface.
-
公开(公告)号:US20240313189A1
公开(公告)日:2024-09-19
申请号:US18674482
申请日:2024-05-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Gunwoo KIM , Seongho SON , Jongsung LEE , Changjoon LEE , Seonghwan SHIN , Tackmo LEE , Soonmin HONG
CPC classification number: H01L33/644 , H01L25/167 , H01L27/124
Abstract: A display apparatus includes: a display module array including a plurality of display modules arranged in a matrix, wherein each display module of the plurality of display modules includes: a substrate including a mounting surface and a rear surface opposite to the mounting surface; a plurality of inorganic light-emitting elements mounted on the mounting surface of the substrate; a metal plate adhered to the rear surface of the substrate and configured to dissipate heat generated by the substrate; a front cover covering the mounting surface; a first conductive layer on the mounting surface; and a second conductive layer between the front cover and the first conductive layer.
-
公开(公告)号:US20210202449A1
公开(公告)日:2021-07-01
申请号:US17134837
申请日:2020-12-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seonghwan SHIN , Sungsoo Jung , Pilyong Oh , Kwangjae Lee , Jeongin Han
IPC: H01L25/075 , H01L33/48 , H01L33/58 , H01L33/62
Abstract: Provided is a display module including a substrate including a mounting surface, a side surface, and a chamfer portion formed between the mounting surface and the side surface, a plurality of inorganic light emitting diodes mounted on the mounting surface and each including a pair of electrodes electrically connected to the substrate, a black matrix arranged between the plurality of inorganic light emitting diodes, and a cover bonded to the mounting surface and configured to cover the mounting surface, wherein the pair of electrodes are oriented in a direction opposite to a direction in which the plurality of inorganic light emitting diodes emits light, and the cover is provided to extend outward of the side surface in an extension direction of the mounting surface.
-
-
-
-
-
-
-