公开(公告)号：US12213270B2

公开(公告)日：2025-01-28

申请号：US17847315

申请日：2022-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongyu Hwang ,  Sangmin Lee ,  Myungjun Kim ,  Jongchul Choi

IPC: H05K5/04 ,  B29C45/14 ,  B29L31/34 ,  G06F1/16 ,  H05K5/02

Abstract: According to an embodiment of the disclosure, an electronic device may include: a housing defining at least one surface of the electronic device. The housing may include: a metal plate comprising at least one penetration hole, a first nonmetallic part combined with the metal plate and surrounding at least a part of a side surface of the metal plate, and a second nonmetallic part at least partially disposed in the at least one penetration hole and providing a part of the one surface.