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公开(公告)号:US12281243B2
公开(公告)日:2025-04-22
申请号:US17884077
申请日:2022-08-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Byungchul Yoo , Byunghoon Lee , Myungjun Kim , Jikang Kim , Jeonghwan Min , Kyoungchae Seo , Changyoung Jeong
IPC: C09J163/00 , B08B3/04 , B08B3/08 , G03F1/22 , G03F1/82
Abstract: An adhesive for an EUV mask includes an epoxy resin composition in an amount of 50 wt % to 80 wt % based on a total weight of the adhesive, the epoxy resin composition including an epoxy resin, a hardener, a toughening agent, a filler, and a curing accelerator, and an inorganic filler in an amount of 20 wt % to 50 wt % based on the total weight of the adhesive, the inorganic filler including one or more of aluminum hydroxide or calcium carbonate.
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公开(公告)号:US12213270B2
公开(公告)日:2025-01-28
申请号:US17847315
申请日:2022-06-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seongyu Hwang , Sangmin Lee , Myungjun Kim , Jongchul Choi
Abstract: According to an embodiment of the disclosure, an electronic device may include: a housing defining at least one surface of the electronic device. The housing may include: a metal plate comprising at least one penetration hole, a first nonmetallic part combined with the metal plate and surrounding at least a part of a side surface of the metal plate, and a second nonmetallic part at least partially disposed in the at least one penetration hole and providing a part of the one surface.
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3.
公开(公告)号:US10087348B2
公开(公告)日:2018-10-02
申请号:US15254701
申请日:2016-09-01
Applicant: Samsung Electronics Co., Ltd. , FINE SEMITECH CORP.
Inventor: Byungchul Yoo , Sungyong Cho , Jaehyuck Choi , Jeongsu Yang , Donghoon Chung , Han-Shin Lee , Myungjun Kim , Ikjun Kim , Jikang Kim , Jeonghwan Min , Kyoungchae Seo
IPC: C08F8/44 , C08F220/06 , C09J133/10 , G03F1/64 , G03F1/82 , C09J133/08 , C09J133/06 , C08F6/02 , C09J133/02
Abstract: A pellicle including a water-soluble adhesive and a photomask assembly including the pellicle are provided. A pellicle may include a membrane, a pellicle frame, and a water-soluble adhesive disposed on the pellicle frame. The water-soluble adhesive may be prepared by a mixture including a water-soluble acrylic adhesive material in an amount of about 40% to about 55% by weight of the mixture, water or a solution of water and alcohol in an amount of about 40% to about 55% by weight of the mixture, and an additive in an amount of about 1% to about 5% by weight of the mixture.
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