公开(公告)号：US11011473B2

公开(公告)日：2021-05-18

申请号：US16519788

申请日：2019-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younhee Kang ,  Byoung-Gug Min ,  Shi-Kyung Kim ,  Min-Woo Song ,  Jae-Seon Hwang

IPC: H01L23/29 ,  H01L21/00 ,  H01L23/552 ,  H01L23/31 ,  H01L23/00

Abstract: Disclosed is a semiconductor package comprising a substrate, a semiconductor chip on the substrate, a molding layer on the substrate covering the semiconductor chip, and a shield layer on the molding layer. The shield layer includes a polymer in which a plurality of conductive structures and a plurality of nano-structures are distributed wherein at least some of the conductive structures are connected to one another.