公开(公告)号：US20150116236A1

公开(公告)日：2015-04-30

申请号：US14445464

申请日：2014-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sun Ho KIM

IPC: G06F3/01 ,  G06F3/038 ,  G06F3/041 ,  G06F3/0354

CPC classification number: G06F3/016 ,  G06F3/03545 ,  G06F3/038 ,  G06F3/0416

Abstract: An electronic device, stylus pen, and method for providing tactile feedback are provided. The electronic device includes a mode recognizing unit configured to recognize a change to a vibration mode, and a frequency processing unit configured to output a first frequency band signal through a touch screen upon entering the vibration mode and to output a second frequency band signal through the touch screen when a specific event occurs.

Abstract translation: 提供了一种电子设备，触针笔和提供触觉反馈的方法。 电子设备包括：模式识别单元，被配置为识别对振动模式的改变，以及频率处理单元，被配置为在进入振动模式时通过触摸屏输出第一频带信号，并通过所述振动模式输出第二频带信号 当特定事件发生时触摸屏幕。

公开(公告)号：US20200294904A1

公开(公告)日：2020-09-17

申请号：US16884316

申请日：2020-05-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun Ho KIM ,  Ji Hoon KIM ,  Ha Young AHN ,  Shang Hoon SEO ,  Seung Yeop KOOK ,  Sung Won JEONG

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L23/31

Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.

公开(公告)号：US20250157065A1

公开(公告)日：2025-05-15

申请号：US18661638

申请日：2024-05-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Hee LEE ,  Jae Hong CHO ,  Sun Ho KIM ,  Bong Ki PARK ,  Byung Chul SONG

IPC: G06T7/521 ,  A46B9/02 ,  A46B13/00 ,  A46B13/02 ,  B08B1/12 ,  B08B1/34 ,  B08B13/00

Abstract: Provided is an apparatus for measuring a brush that measures shapes of nodules included in the brush and manages specifications of the nodules. The apparatus includes a rotating unit configured to rotate the brush, a sensor unit spaced apart from the brush in a second direction intersecting the first direction, a horizontal drive unit configured to move the sensor unit in the first direction; and a controller configured to control at least one of the sensor unit, the rotating unit, and the horizontal drive unit. The brush includes a first row including nodules spaced apart from each other in the first direction. The controller is configured to control the sensor unit and the horizontal drive unit such that while the horizontal drive unit moves the sensor unit in the first direction, the sensor unit performs first measurement of a shape of each of the nodules included in the first row.

公开(公告)号：US20200043842A1

公开(公告)日：2020-02-06

申请号：US16598046

申请日：2019-10-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun Ho KIM ,  Ji Hoon Kim ,  Ha Young Ahn ,  Shang Hoon Seo ,  Seung Yeop Kook ,  Sung Won Jeong

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L23/31

Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.