公开(公告)号：US11676824B2

公开(公告)日：2023-06-13

申请号：US16540466

申请日：2019-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-kwon Kim ,  Seung-ho Park ,  Sang-won Bae ,  Woo-in Lee ,  Hyo-san Lee ,  Sun-jae Jang

IPC: H01L21/321 ,  B24B37/04 ,  B24B57/00 ,  B24B37/11

CPC classification number: H01L21/3212 ,  B24B37/04 ,  B24B37/11 ,  B24B57/00

Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing pad on a polishing platen, a polishing head on the polishing pad, the polishing head having a membrane to hold a wafer on the polishing pad, and a polishing slurry feeding line to feed a polishing slurry, and a retainer ring around the membrane and in contact with the polishing pad to prevent detachment of the wafer, the retainer ring including a polishing slurry feeding inlet connected to the polishing slurry feeding line to feed the polishing slurry onto the polishing pad.

公开(公告)号：US20200185231A1

公开(公告)日：2020-06-11

申请号：US16540466

申请日：2019-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-kwon Kim ,  Seung-ho Park ,  Sang-won Bae ,  Woo-in Lee ,  Hyo-san Lee ,  Sun-jae Jang

IPC: H01L21/321 ,  B24B37/04 ,  B24B37/11 ,  B24B57/00

Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing pad on a polishing platen, a polishing head on the polishing pad, the polishing head having a membrane to hold a wafer on the polishing pad, and a polishing slurry feeding line to feed a polishing slurry, and a retainer ring around the membrane and in contact with the polishing pad to prevent detachment of the wafer, the retainer ring including a polishing slurry feeding inlet connected to the polishing slurry feeding line to feed the polishing slurry onto the polishing pad.